| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 209-100 |
CARRIER FOR SPARE ADJACENT JUMPERS SUITABLE
|
List of Unclassifed Manufacturers
|
| A-DS15PP-WP-R |
WATERPROOF DSUB CONNECTOR
|
Assmann Electronics Inc.
|
| 1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
| A-DS09PP-WP-R AE10098 |
9 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER ROHS COMPLIANT
WATERPROOF DSUB CONNECTER
|
Assmann Electronics, Inc.
Assmann Electronics Inc.
|
| SU10000RT3UPM |
SmartOnline 200-240V 10kVA 9kW UPS Spare - Redundant Power Module, 3U Rack-Tower
|
Tripp Lite. All Rights ...
|
| 6205.2100 |
Power Entry Module; IEC; Voltage Rating: 250V; Current Rating: 10A; Terminal Type: Solder Tabs; Spare fuse compartment; blackThermoplastic housing 10A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER, SOCKET
|
SCHURTER AG
|
| EC000830 27061801 |
D-SUB cable - VS-09-DSUB-20-LI-1,0 - 1656233
|
PHOENIX CONTACT
|
| SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 6A die sawn
Diodes - HV Chips - 600V, 6A die unsawn
|
Infineon
|
| SIDC00D60SIC2SAWN SIDC00D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 2A die sawn
Diodes - HV Chips - 600V, 2A die unsawn
|
Infineon
|
| IRLC1304 2299 |
HEXFET Power MOSFET Die in Wafer Form(晶圆形式的HEXFET 功率MOS场效应管)
From old datasheet system
HEXFET? Power MOSFET Die in Wafer Form
|
International Rectifier
|
